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  • Products Name: Rigid FR4 material multilayer PCB
  • Number: PCB-2-257
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Production name: Rigid FR4 Material multilayer PCB with immersion gold surface finished
Key specifications/special features:
Application for: communication apparatus, automobile electronics computers, medical devices and consumer electronics class fields as medical equipment device
Base material: board thickness: 1.6mm
Layers: 4 minimum
Line width/spacing: 4-mil
Minimum hole diameter: 0.3mm
Finishing copper thickness: 1oz
Surface finishing: immersion gold
Solder mask: green
Craft ability table: minimum line width/spacing: 0.075/0.075mm
Minimum solder mask dam: 0.075mm
Minimum and maximum board thickness: 0.2-3.5mm
Maximum finishing copper thickness: 0.5-4oz
Maximum layers count: 8
Impedance control: ±8%
Surface finishing: HASL, lead free HASL, OSP, ENIG, gold
Finish hole size: PTH +/-0.003'', NPTH +/-0.002
Hole position accuracy: +/-0.003"
Ring annulus: min 0.1mm
Aspect ratio: min 1: 8
Min plated drills to copper: 0.25mm, 0.35mm
Testing: flying-probe testing, E-testing
Equipment: LDI exposure machine, AOI inspection, large-scale laminating machine, laser drilling machine, horizontal PTH, automatic exposure machine, DES line, automatic CNC, automatic tester, automatic visual inspection, vertical circular electroplating machine, automatic immersion gold machine, drilling machine, high-speed flying probe tester