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  • Products Name: Printed circuit board assembly
  • Number: PCB-2-270-#3882
  • Views : 3

  • Product name: printed circuit board assembly, circuits assembly, surface mount, through-hole soldering
  • Layers: multiple layers
  • Board thicknesses: 1.6mm
  • Board thickness tolerance: around 5%
  • Minimum hole size: 0.2mm
  • Minimum track width/space: 0.075/0.075mm
  • Solder mask thickness: 0.01mm
  • Material: FR-4/Hi Tg FR-4/lead-free
  • Materials (RoHS Directive-compliant)/CEM-4, aluminum, metal based
  • Layer number: 1-16
  • Finished board thickness: 0.2-3.5mm (8-138mil)
  • Board thickness tolerance: ±10%
  • Cooper thickness: 0.5-4oz (18-144um)
  • Copper plating hole: 18-30um
  • Impedance control: ±10%
  • Warp and twist: 0.70%
  • Image:
    • Minimum trace width (a) 0.075mm (3 mil)
    • Minimum space width (b) 0.075mm (3 mil)
    • SMD pitch (a) 0.2mm (8 mil)
    • BGA pitch (b) 0.2mm (8 mil)
  • Solder mask:
    • Minimum solder mask dam (a) 0.0635mm (2.5mil)
    • Soldermask Clearance (b)0.075mm (3 mil)
    • Minimum SMT pad spacing (c) 0.075mm (3 mil)
    • Solder mask thickness 0.0007" (0.018mm)
  • Holes:
    • Minimum hole size (CNC): 0.2mm (8 mil)
    • Minimum punch hole size: 0.9mm (35 mil)
    • Hole size: tol (+/-) PTH: ±0.075m, NPTH: ±0.05mm
    • Hole position: Tol ±0.075mm
  • Plating:
    • HASL/lead-free HASL: 2.5um
    • Immersion gold nickel: 3-7um/Au: 1-5u"
    • OSP: 0.2-0.5um
  • Certifications: ISO 9001, SGS, UL
  • RoHS Directive-compliant
  • Production line
  • We always adhere to using advanced concepts and mature sound technical production to better meet the needs of market
  • Through unremitting efforts, our R and D team now manufacture multilayer blinds, buried hole circuit boards, flexible circuit boards (FPC), high-precision impedance, HDI, and other special circuit boards