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  • Products Name: Android USB Charger Immersion Gold/OSP Surface Finished PCBs
  • Number: PCB-2-024
  • Views : 46

  • Technical capability:

    • Layers: 1-20L

    • HDI range: HDI ELIC (5+2+5)

    • Core thickness: 0.05-1.5mm

    • Finished board thickness: 0.2-3.5mm

    • Board thickness tolerance: around 5%-10%

    • PCB testing

  • Minimum hole size:

    • Laser: 0.1mm/4mil

    • Mechanical: 0.15mm/6mil

    • Minimum track width/space: 0.0375mm/0.0375mm (1.5/1.5mil)

    • Copper thickness: 1/3-5oz

    • Registration accuracy: ±0.05mm/2mil

    • Routing accuracy: ±0.075mm/3mil

    • Minimum BGA pad: 0.23mm (9mil)

    • Maximum aspect ratio: 10:1

    • Bow and twist: 0.50%

    • Impedance control tolerance: ±8%

    • Daily output: 8000m2

    • Surface finishing: ENIG/OSP/HASL/Au plating/immersion tin/immersion silver/selective ENIG

    • Raw material: FR4/common TG/high TG/low Dk/low Df/lead free/halogen free material

    • Flammability: 94V0 standard

    • Solder mask thickness: 0.01mm

    • Date file format: gerber file

    • Certifications: UL, SGS, ISO 9001 and TS16949

  • Primary competitive advantages:

    • Experienced staff

    • Guarantee/warranty

    • International approvals

    • Price

    • Product features

    • Product performance

    • Prompt delivery

    • Quality approvals

    • Reputation

    • Service

    • Small orders accepted

  • Main export markets:

    • Asia

    • Australasia

    • Central/South America

    • Eastern Europe

    • Mid East/Africa

    • North America

    • Western Europe

  • Payment terms: T/T bank/PayPal/HSBC

  • Delivery details:

    • FOB port: Shenzhen

    • FOB range:  USD 0.17-USD 9.9

    • Lead-time: 4-6 days