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Ball grid array Description Printed circuit board

Date:2017年5月11日 17:02

Ball grid array Description Printed

circuit board

Ball grid array

Description

BGA ICs assembled on a RAM stick

The BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern which, in operation, conduct electrical signals between the integrated circuit and the printed circuit board (PCB) on which it is placed. In a BGA the pins are replaced by pads on the bottom of the package, each initially with a tiny ball of solder stuck to it. These solder spheres can be placed manually or by automated equipment, and are held in place with a tacky flux. The device is placed on a PCB with copper pads in a pattern that matches the solder balls. The assembly is then heated, either in a reflow oven or by an infrared heater, melting the balls. Surface tension causes the molten solder to hold the package in alignment with the circuit board, at the correct separation distance, while the solder cools and solidifies, forming soldered connections between the device and the PCB.

In more advanced technologies, solder balls may be used on both the PCB and the package. Also, in stacked multi-chip modules, solder balls are used to connect two packages.

 

 

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TypeInfo: PCB knowledge

Keywords for the information:Ball grid array  Ball grid array Description  Printed circuit board