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Process Capability

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Product Range

4-28 layer of high-precision impedance, blind & buried layers, HDI boards, high frequency board, halogen-free boards, high-TG boards, aluminum, copper, iron base and ceramic-based circuit board, 1-6 layer flexible circuit board ( FPC) and rigid-flex flexible board, and other high-tech products.

PCB Process Capability

  • processing layers: 1- 30 layers
  • Finished thickness:  0.008 "~ 0.24" (0.20mm ~ 6.0mm)
  • Minimum aperture: 6mil (0.15mm)
  • Minimum line width / spacing: 3-4 mil (0.076-0.10mm)
  • Maximum board size: Single & Double 22 "x 43" (550 x1100mm), Multi-layer 22 "x 25" (550mm x 640mm)
  • Impedance Control: ± 10%
  • Surface Treatment:  OSP,  HASL, Electric Nickel / Gold, Chemical nickel / gold, lead-free HASL , Gold finger, immersion Silver, Immersion Tin.
  • Base materials: FR4 ( ShengYi, KB, International), high TG (TG150, TG170), halogen-free board (Halogen-free), High frequency plate (Rogers, Teflon, Taconic), made PTFE (PTFE), AL aluminum plate (Berquist, Al-made basis), copper (Cu Base), Iron (Fe Base), Ceramic substrate (Ceramic Base)
 
FPC Process Capability
  • processing layers: 1-6 layers
  • Finished thickness: 3mil (0.08mm)
  • Minimum aperture:  4mil (0.10mm)
  • Min.line width / spacing: 2 mil (0.05mm)
  • Maximum board size: 10 "x 45" (250x 1200mm)
  • Surface Treatment: OSP,  HASL, Electric Nickel / Gold, , Chemical nickel / gold, lead-free HASL, Immersion Gold
  • Insulation resistance:  ± 1011Ω (Normal Normal)
  • Thermal shock resistance: 260 ℃ 10 sec.
  • Processing materials:  Polyimide (PI), polyester (PET), polyimide (PI) + FR4
 
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